Sencio plays winning role in AMA Innovation

Award consortium

 

The Netherlands, Nijmegen, 25 May, 2016 – An industry consortium led by Siemens together with Sencio, Sensitec and M2 Automation has been awarded the AMA Innovation Award 2016 for development of Magnetic Flow Cytometry (MRCyte). This year’s € 10,000 prize was shared between the Magnetic Flow Cytometry team and developers working on Nerves of Glass. Both submissions were deemed by the jury to have an outstanding degree of innovation as well as great market relevance. The AMA Association for Sensors and Measurement presented the award winners at the SENSOR+TEST trade fair in Nuremberg on 10 May 2016.

Oliver Maiwald takes over as CEO of Sencio

 

Sencio is very pleased to announce that Oliver Maiwald has joined our management team as Chief Executive Officer. His appointment will allow John Pleumeekers to take up a new role as Chief Operating Officer, responsible for Sencio’s European and Far East operations.

Sencio’s nCapsulate cuts system assembly costs

Complete freedom of shape brings an extra dimension to sensor and MEMS encapsulation, allowing manufacturers to streamline or eliminate assembly steps

Nijmegen, the Netherlands, May 14, 2013 – Independent package development and assembly specialists Sencio BV is bringing an extra dimension to sensor and MEMS encapsulation with the launch of its nCapsulate freeform packaging technology.

ATEC and Sencio sign strategic deal to strengthen assembly services for MEMS and sensors

Captive manufacturing agreement expands Sencio’s capacity for high-volume, automotive qualified assembly of MEMS and integrated sensor systems

Nijmegen, the Netherlands, April 16, 2013 – Independent package development and assembly specialists Sencio BV today announced a deal with Automated Technology (Phil) Inc. to create a captive assembly line at ATEC’s facilities in Laguna, Philippines.

Sencio expands encapsulation options with FAM system

New Film Assisted Molding system enables glass-on-die sensor encapsulation in QFN footprint

Nijmegen, the Netherlands, December 20, 2012 – Independent package development and assembly specialists Sencio BV today announced a major new investment in a Film Assisted Molding (FAM) system.

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