Sencio expands encapsulation options with FAM system

New Film Assisted Molding system enables glass-on-die sensor encapsulation in QFN footprint

Nijmegen, the Netherlands, December 20, 2012 – Independent package development and assembly specialists Sencio BV today announced a major new investment in a Film Assisted Molding (FAM) system.

This investment highlights Sencio’s ongoing commitment to offer the latest functional packaging and encapsulation technologies and to provide cost-effective assembly services. The FAM equipment will be primarily used for the volume production of functional QFN-package solutions.

 

“The installation of this FAM molding system is a further step in being able to supply complete functional packaging solutions for our customers,” said Sencio General Manager John Pleumeekers. “Complementing our existing cavity molding technology, film assisted molding offers an excellent solution for applications such as optical systems, especially glass-on-die. It can also be used for exposed die applications or cavity QFN.”

 

With the drive towards smaller, lighter and more added features in electronics, the QFN package footprint has become an important trend for MEMS and sensors. This trend is set to continue with developments in mobile sensing applications. The FAM equipment allows cavity QFN encapsulation without using expensive tape and the associated pre-tape and de-tape processes. Sencio is currently developing functional QFN-package solutions for volume assembly, including an optical sensor with a glass filter in a 4x4 mm QFN footprint.

 

FAM molding enables cost-effective manufacturing of advanced functional packages in high volume production, while achieving the highest device reliability. It is particularly suitable for the encapsulation of sensitive MEMS or sensors and associated circuitry where an exposed window is needed to access the environment, for example in gas and liquid sensors.

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