Sencio’s nCapsulate cuts system assembly costs

Complete freedom of shape brings an extra dimension to sensor and MEMS encapsulation, allowing manufacturers to streamline or eliminate assembly steps

Nijmegen, the Netherlands, May 14, 2013 – Independent package development and assembly specialists Sencio BV is bringing an extra dimension to sensor and MEMS encapsulation with the launch of its nCapsulate freeform packaging technology.

nCapsulate offers complete freedom of shape when encapsulating semiconductor sensors or MEMS. This allows manufacturers to add functional features that streamline assembly or to integrate the device encapsulation directly into system housing components, leading to faster, more cost-effective system assembly.

 

nCapsulate uses transfer molding with a thermosetting compound that delivers better isotropy and thermomechanical stability than the thermoplastics of standard injection molding technologies. It combines this with special mold tools developed by Sencio and a toolshop partner. Together, these developments enable device encapsulation that delivers the same excellent protection as traditional packages but that can be formed into any shape required. For example, manufacturers can use nCapsulate to add mounting, alignment and support features to a standard package design, or embed sensors or MEMS directly into plastic components such as tubes and system casings.

 

“We aim to develop new encapsulation solutions that bring customers real added value,” says Jurgen Raben, manager technology, research & innovation of Sencio BV. “nCapsulate does exactly that. It’s freeform nature helps manufacturers streamline or even eliminate post-encapsulation assembly steps to improve production efficiency and save money. Moreover, customers can combine nCapsulate with our other functional packaging capabilities, such as the ability to expose sensor surfaces while protecting delicate integrated circuits, to create a functional packaging solution tailored to their precise needs.”

 

nCapsulate can be applied to leadframe based packaging as well as other substrates such as PCBs or ceramics.

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