Packaging services - back end wafer processing 

Sawing and backgrinding

 

As part of our complete assembly service, we can naturally handle your delicate (sensor) wafers with care when preparing them for assembly. We can also offer each assembly stage as stand-alone services, so for example we can manage backgrinding and sawing of wafers and return bare dies to you.

 

Chip and package thicknesses often need to be tuned, and we can provide this service for wafers up to 8”. We have wide experience of sawing sensors with membranes and our in-house capability includes fully automatic wafer inspection, used to detect both wafer and sawing defects.

 

Need delicate and careful handling of wafers? Discover how our back end processing capabilities can help you.

 

Wafer sawing

 

 

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Transistorweg 7
6534 AT Nijmegen
The Netherlands

+31(0)24 371 4499
www.sencio.nl
info@sencio.nl
30288321
NL822467239B01