Packaging technologies

As semiconductor devices become ever more integrated and complex to meet the growing demands of always on, connected IoT solutions, so do the demands on packaging. Our range of packaging technologies provides the foundation for high quality encapsulation solutions for your MEMS, sensors and multichip modules.

Calling on a range of technologies and package outlines ensures Sencio can find the right option to fit your device requirement – from exposed die , LGA assembly and QFN map moldings to MCM molding, globtop molding and our flagship nCapsulate. And we can help you at any or all stages of package development for your device – from package development right through to automotive qualified volume production and assembly.

Contact us to discover the right package technology to encapsulate your device and deliver the protection you need.

Packaging solutions

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6534 AT Nijmegen
The Netherlands

+31(0)24 371 4499