Custom-designed package for Temic-Conti front-airbag acceleration sensor was introduced in 1997

 

Different technologies are combined in this functional package design, including stress free sensor mounting, globtop molding, multi-die encapsulation and a very special leadframe design with customized trim-and-form.

First application of our exposed die molding for an optical linear array sensor used in an automotive power-steering application

 

In 1997 we developed a functional package for an optical linear array.

An absolute pressure sensor device used in an automotive side airbag application

 

Using the cavity molding technology a pre-molded cavity was created in a SOIC 20 JEDEC outline package in which we mounted and assembled an ultra-small pressure sensor.

A functional fluid sensor package ready for automotive application

 

The SOIC 28 Fluid Condition Sensor package demonstrates a typical use of our cavity molding technology.

Packaging technologies - MCM Molding

Your complete multichip system in one functional package

 

One of the key packaging technologies capable of handling increasing system complexity is the multichip module (MCM).

Latest News

Sensor packaging with a taste for bodily fluids!   Our ageing and...

Read more >>
Helping make 5G capabilities affordable   Sencio is contributing to a new...

Read more >>
CEO update – influence of extreme testing complexity on packaging   Electronics...

Read more >>
Read our stories
Newsletter
nCapsulate Whitepaper
Transistorweg 7
6534 AT Nijmegen
The Netherlands
+31(0)24 371 4499
www.sencio.nl
info@sencio.nl
30288321
NL822467239B01