A functional fluid sensor package ready for automotive application

The SOIC 28 Fluid Condition Sensor package demonstrates a typical use of our cavity molding technology.

In this specific functional package the active sensor area is completely exposed to the medium by creating a through-hole in the package using our cavity molding technology both on the top as well as on the flip side of the package. While an ASIC and the interconnects are protected by compound encapsulation, the sensor area is immersed in motor oil and needs to withstand these harsh conditions during the life time of the car engine.