For the 1st time, Sencio will be present at the Electronics in Harsh Environment exhibition in Amsterdam. This 2,5-day event tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Packaging & assembly is an important topic when it comes to electronics in harsh environments. 

Curious to learn our best practices? Just visit our booth in the foyer and let us surprise you with our way of looking to packaging for harsh environments.

If you would like to reserve a time slot on before hand, simply This email address is being protected from spambots. You need JavaScript enabled to view it. and we will arrange it for you.

The Sencio-team is looking forward to meeting you at Electronics in Harsh Environments 2019. 

For the 9th time in a row, Sencio will be present at the Sensor+Test exhibition in Nurnberg. This 3-day event with about 600 exhibitors and 8000 visitors is key for the digitzing measuring world with increasing need for sensors. Packaging & assembly remains an important topic for sensors in general and MEMS sensor systems in specific. Year after year we have been able to show the engineers community how we can solve their packaging challenge.

The theme of our booth is this year: "The problem solving packaging company". For over 30 years now, it is our passion to design the right packaging solutions for sensor systems for our customers. How we bring this into practice? Just visit our booth, Hall 1, #227, and let us surprise you with our way of looking to packaging......

If you would like to reserve a time slot on before hand, simply This email address is being protected from spambots. You need JavaScript enabled to view it. and we will arrange it for you.

The Sencio-team is looking forward to meeting you at Sensor+Test2019. 

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