Sensor packaging with a taste for bodily fluids!
Our ageing and health-conscious societies are relying on more and more sensors to measure the human body’s health functions. We see ‘medical’ sensors appearing in a whole range of consumer applications to measure pulse rate, blood pressure and blood sugar levels to name just a few. But it is not just ‘tracking’ sensors that are becoming more prevalent.
Helping make 5G capabilities affordable
Sencio is contributing to a new development project aimed at advancing 5G (fifth generation) communications technologies – the 5G_GaN2 project. 5G is set to revolutionize all applications that use wireless communications, from autonomous driving to IoT and mobile networks. However, a major challenge in developing 5G systems is to bring affordable, high-performance millimeter wave (mm-wave) active antenna arrays into production.
Joint learning delivers new RFID solution for NedCard
As a specialized semiconductor assembly and testing company, NedCard is a leading player in tailored chip card package solutions, mainly for banking, telecom and eGovernment.
Assembly landscape is changing
The landscape for semiconductor and sensor assembly is changing. On one hand we see the move to further miniaturization through wafer-scale packaging,
Refining the design of a chemiluminescence biochip
At the end of January, Sencio joined the rest of the Biochip project team (including development partners EPR Partner, Micronit and Fuse Design Consultants) for a two day bootcamp in Hotel Ruimzicht (Doetinchem, NL) organised by the project’s lead, Enzyre. The focus of the bootcamp was to draw up and refine
EuroPAT-MASIP – bold aims for European packaging
Towards the end of September, the EuroPAT-MASIP project outlined some of its goals and targets (read the EuroPAT-MASIP press release). With Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking approved funding, the project aims to develop packages for six pilot products:
PAMPA final review highlights outstanding results
On the 20th September, the PAMPA (Plastic Components for Advanced Microwave Equipment of New Generation SatCom PAyloads) project team held their final project review at the Thales Alenia Space premises in Toulouse, France.
EuroPAT-MASIP project is live
The European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-In-Package (EuroPAT-MASIP) project was officially kicked off in Berlin back in April with the full consortium present. By focusing on the semiconductor and MEMS packaging ecosystem it aims to reinforce the European
The changing value-chain of system design
One of the topics touched on at the SEMI Industry Strategy Symposium (ISS) Europe 2017 was the way that the electronics and semiconductor value-chain has been changing over the last few years. The traditional value-chain has very simply been:
