EuroPAT-MASIP project is live

The European Packaging, Assembly and Test Pilot for Manufacturing of Advanced System-In-Package (EuroPAT-MASIP) project was officially kicked off in Berlin back in April with the full consortium present. By focusing on the semiconductor and MEMS packaging ecosystem it aims to reinforce the European

semiconductor manufacturing position over the next three years and accelerate the manufacturing uptake of advanced packaging technologies.

There is a whole host of companies involved in the project from research institutes to wafer suppliers and semiconductor manufacturers, and everything in between. As advanced packaging technologies are key to the project, Sencio is looking forward to playing a key role in the project.