EuroPAT-MASIP – bold aims for European packaging

Towards the end of September, the EuroPAT-MASIP project outlined some of its goals and targets (read the EuroPAT-MASIP press release). With Electronic Components and Systems for European Leadership (ECSEL) Joint Undertaking approved funding, the project aims to  develop packages for six pilot products:

WLAN front-end IC, silicon photomultiplier, automotive inertial sensor and a camera, 60 GHz radar sensor and a car tyre sensor.

While R&D activities for semiconductor product development remain a focus in Europe, apart from some specialist players, back end processing has been more focused in Asia. Having strong technical and manufacturing building blocks for packaging available locally has become more vital as device performance is increasingly linked to package performance and footprint.

From Sencio’s perspective it is great to see the semiconductor packaging, assembly and test value chain combine skills and expertize to see how far we can push packaging technology to address the challenges of traditional and emerging sectors.