ATEC and Sencio sign strategic deal to strengthen assembly services for MEMS and sensors

Captive manufacturing agreement expands Sencio’s capacity for high-volume, automotive qualified assembly of MEMS and integrated sensor systems

Nijmegen, the Netherlands, April 16, 2013 – Independent package development and assembly specialists Sencio BV today announced a deal with Automated Technology (Phil) Inc. to create a captive assembly line at ATEC’s facilities in Laguna, Philippines.

This strategic agreement enables Sencio to offer its customers cost-effective, high-volume, TS16949 qualified assembly while maintaining transparency, production oversight and control over the supply chain.


“With this captive manufacturing agreement, Sencio takes the next step in our company development as the functional packaging center for MEMS and sensors. Finding a partner to meet all our requirements could have been a challenge. However ATEC’s reputation as a customer-oriented organization with a quality mind-set and a consistent delivery performance made the decision easy,” said John Pleumeekers, general manager, Sencio. ”By working with a proven automotive-qualified partner, our customers can benefit from cost-effective high-volume assembly, secure in the knowledge that Sencio continues to protect their technology with ours.”


“We are excited about this agreement. Not only does it help establish ATEC as a player in the automotive sensor space, but by partnering with Sencio we also gain entry to the European market. I am sure that the engineering expertize of Sencio and our capabilities in providing high quality manufacturing processes and delivery will be a very powerful combination,” said ATEC chairman and CEO, Renato M. Tanseco. 


This initial agreement provides Sencio with manufacturing space for a Class 10k cleanroom environment, and the option of an additional space as required. Preparing the cleanroom and moving in the first equipment is already underway. Following the proven ‘copy exactly’ approach to technology transfer, the first assembly line is a direct copy of Sencio’s current multi-chip module (MCM) line in Nijmegen. The first qualified products are expected in October 2013. Initial capacity is estimated to be 2.5 million devices per year, rising to 6-8 million per year by 2015.

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