Packaging innovations 

When you consider there is no such thing as a ‘standard sensor’ design, then it can be difficult to imagine exactly how your final packaged product could look. This becomes more challenging when the actual packaging needs to play a functional role in sensor / MEMS operation. 

From the integration of functional shapes, mechatronics, micro structures / micro fluidics or simply overmolding passive components, that means the package becomes part of the unique properties of a product design. 

In addition to customer specific requests Sencio is also involved in several funded development projects. This helps ensure we are at the cutting-edge of package design, but also gives us the opportunity to highlight some of the innovation and development projects that are currently active. 

Take a look and if you see something that could be an inspiration for your next MEMS or sensor design, then contact us to see how we can help.


Latest News

Sensor packaging with a taste for bodily fluids!   Our ageing and...

Helping make 5G capabilities affordable   Sencio is contributing to a new...

CEO update – influence of extreme testing complexity on packaging   Electronics...

Read our stories
nCapsulate Whitepaper
Transistorweg 7
6534 AT Nijmegen
The Netherlands
+31(0)24 371 4499