Packaging innovations 
 

When you consider there is no such thing as a ‘standard sensor’ design, then it can be difficult to imagine exactly how your final packaged product could look. This becomes more challenging when the actual packaging needs to play a functional role in sensor / MEMS operation. 

From the integration of functional shapes, mechatronics, micro structures / micro fluidics or simply overmolding passive components, that means the package becomes part of the unique properties of a product design. 

In addition to customer specific requests Sencio is also involved in several funded development projects. This helps ensure we are at the cutting-edge of package design, but also gives us the opportunity to highlight some of the innovation and development projects that are currently active. 

Take a look and if you see something that could be an inspiration for your next MEMS or sensor design, then contact us to see how we can help.