Solutions to solve your packaging puzzles

Complex or delicate devices can present you with significant packaging puzzles. We can help you solve them. Sencio offers functional packaging solutions for devices and systems such as MEMS and integrated sensor systems, opto-electronics and RF modules. Our solutions are complemented by a complete range of package design, prototyping, assembly and test services.

Our experience in package development and volume manufacturing of sensor components and systems spans over 25 years. So whatever your market – automotive, industrial, medical, aerospace, portable and wearable, etc., and for virtually any application, we can support you as a world class competence center for functional packaging.

Whatever packaging or assembly puzzle you face, we can help you realize your ideas.