Packaging solutions for RF modules

Taking RF module performance to new heights 

The increasing demand for RF modules places ever more focus on ensuring the best packaging. Among the most complex of all electronic devices, RF modules often integrate analog, digital and RF components in a single multichip module (MCM). While this brings numerous benefits in terms of size and performance, it does incur added challenges for package design and assembly.

One way to address these challenges is using multichip package variants using over-molded plastic package options. By drawing on our experience of using MCM molding for a range of automotive qualified applications and our QFN map molding technology, Sencio has developed a number of proven high quality solutions for RF power packages.

Contact us to learn more about our solutions for RF packages.