Packaging technologies - exposed die molding

Naked truth about exposed die encapsulation

Patented insert technology, or film assisted molding (FAM), enables exposed die devices. Due to the fact that sensors are getting smaller and smaller, Sencio recognizes the need for smaller devices. Sencio has managed to decrease the exposed die area to below 1 millimetre diameter. It enables cost-effective manufacturing of advanced functional packages in high volume production, while achieving the highest device reliability.

It is recommended for the encapsulation of sensitive MEMS or sensors and associated circuitry, where an exposed window is needed to access the environment, such as gas and liquid sensors. In particular the QFN package footprint meets the latest challenges set by mobile sensing applications, squeezing ever more into less space.

Open up your system possibilities with our exposed die technology. Contact us for more.