Packaging technologies - Glass on die molding 

A window integrated into your IC package


For various optical applications, glass on die technology is the best way to encapsulate your device. This technology allows a small glass plate to be glued on top of the optical area. To further expand application options a colour filter can be applied instead of a glass plate. 


Interconnection to the substrate is made by wire bonding. Then the overall system is molded by using exposed die (film assisted) molding technology, leaving the glass lid / filter free of molding compound.


Our extensive know-how and experience enables us to select the best materials for this process. In this way the optical functionality of your device is secured within a robust and reliable encapsulation.


Need to develop a clear-cut proposal for your device package – contact us now.


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