Packaging technologies - nCapsulate

Adding extra dimensions to sensor / system encapsulation

nCapsulate freeform packaging adds new dimensions to semiconductor, sensor, system and MEMS encapsulation. With complete freedom of shape and mechanical system integration you can add extra features to your package to streamline system assembly. Or even integrate your device encapsulation directly into your system housing. In short, nCapsulate helps you improve efficiency and cut costs in system assembly.

Based on a transfer molding processes, nCapsulate uses a thermosetting compound that delivers better isotropy and thermomechanical stability. This is combined with specially developed mold tools to create device encapsulation that offers the same excellent protection as traditional packages, but formed into any shape you want.

Combining electronic and mechanical elements opens the way to real, practical solutions that simplify system challenges. You can add mounting, alignment and support features to a standard package design. The housing can become a complete system in package (SiP) with an ASIC and sensor, as well as passive components supplemented with embedded mechanical elements. There’s the potential to integrate your entire system, even eliminating the need for a PCB.

You can apply nCapsulate technology to any leadframe-based packaging as well as other substrates such as PCBs or ceramics. In addition, you can combine nCapsulate with any of our other encapsulation technologies to create a functional packaging solution tailored to your precise needs.

Let your creativity flow and design the encapsulation shape that integrates all the elements you need. Download the nCapsulate whitepaper to find out more.